FVSS has the following excellent features: Design: Freedom of design is dramatically improved.This contributes to a shorter period of development. Narrow pitch CSP: Wiring at 0.4mm CSP is possible. Board Size: Board size and thickness can be greatly reduced. Characteristics: Excellent electrical characteristics and heat liberation ability. Reliability: Greater connection reliability and drop test performance.   1‐6‐1 1‐4‐4‐1 FVSS1-250 FVSS3-250 FVSS3-150 Layer structure Line/Space 75/75 75/75 75/75 75/75 50/50 Internal Land Diameter 550 550 550 - - LVH Land Diameter 275 275 250 250 150 Auto Routing Ratio 66.6% 68.7% 77.3% 88.4% 100% Automatic routing and wire connection is enhanced with FVSS stack-up structure, small-diameter land and fine pattern formation. *Contact us for details on FVSS features.