Electronics | Build-up Substrates

The recent miniaturization of electronic equipments such as mobile phones demands ever smaller via holes. To this end, IBIDEN offers laser via holes PWB using resin-coated copper film (RCF) or glass epoxy resin (FR-4).

Features

  • Allows for high-density circuits
  • Compatible with UL 94V0 or equivalent
  • Allows for smaller via holes
  • Suitable for halogen-free products
  • Helps make product light and thin

Specifications

Item Standard Manufacturing Specifications
Process Tenting
Number of layers 6 layers or more
UL 94V0 or equivalent
HDI dielectric thickness 0.06mm (standard)
Number of HDI layers 2 stacks
Core material thickness 0.1mm or more
LVH (Laser-drilled via) diameter ø0.20mm
PTH (drill) diameter ø0.50mm or more

Applications

  • Mobile Phone
  • Digital Camcorder
  • Digital Still Camera
  • Next Generation Compact Module
  • Other Compact Mobile Devices

Please contact the following for Build-up PWB-related inquiries and any request for quotations.
For Inquiries

Sales &Marketing Group 2, Sales &Marketing Division
PWB Unit, Electronic Circuits Operation, Electronics Operation Group
300 Aoyanagi-cho, Ogaki, Gifu Prefecture 503-8503

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