Electronics | e-Flex

Rigid-flexible substrates partially using flexible materials. By eliminating a connector,it achieves thinner products and high connection reliability.

Features

  • Same design rule as FVSS is applicable to Rigid part
  • Cost reduction by introducing Partial Flex
  • No restriction in assembly area (Rigid edge)
  • High Reliability against Dynamic Bending
  • Copper Plating in Flex is available.

Specification

L10 Any
Item Specification
1. Layer count on Flex part < 2 layers
2. Layer Count
(Combine with Rigid Flex)		 4~10 layers
3. Land Diameter > 150(um)
4. HDI Dielectric thickness 50~60(um)
5. Dielectric thickness of Flex material 25~50(um)
6. Line/Space Min 50/50(40/40)µm
7. Board thickness > 0.39(mm)

Application

  • Mobile Phone
  • Digital Camcorder
  • Digital Still Camera
  • Next Generation Compact Module

Please contact the following for e-Flex-related inquiries and any request for quotations.
For Inquiries

Sales &Marketing Group, PWB Unit, Electronic Circuits Operation
300 Aoyanagi-cho, Ogaki, Gifu Pref. 503-8503

Return to Top of Page