Electronics | Multi-layer GRL Substrates

Multi-layer GRL substrate is suitable for Wire bonding and Flip Chip bonding, applying Build-up technology, using insulator layer made of the glass-reinforced-laminates, and fine pitch patterning technology with utilizing ultra thin copper foil.
Ultra-small vias and fine pitch patterning technologies allow high density routing and realize small sized package substrates. Also, we can offer total solution from substrate design to high volume manufacturing, including simulation technology for achieving electric requirement for high speed performance.

Features

  • Build-up structures with high design freedom
  • Fine patterning for narrow pitch wiring.
  • Downsize and ultra thin of Board size
  • Stable wire bondability
  • High interconnect and insulation reliability.

Specifications

Specifications
Item Standard Manufacturing Specifications
1) Number of layers 4 layers (1-2-1)
6 layers (2-2-2)
2) Trace Pitch 50µm or more
3) Land ø 170µm or more
4) Interlayer thickness 40µm
5) Board thickness 0.25mm or more

Applications

  • Mobile Phone
  • Digital Still Camera
  • Game
  • Other Compact Mobile Devices

Please contact at the following address for any inquiries and any requests for quotations regarding Multi-layer GRL substrates.
For Inquiries

Business Administration Group
Business Administration Group Division
Package Substrate Unit
Electronic Circuits Operation
3-200 Gama-cho, Ogaki, Gifu 503-8559, Japan

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