Electronics | Package Substrates

We provide LLBS substrate, a Flip chip package for mounting, using glass-cloth materials in core, forming insulation layers by Build-up method, microvias, and micro fine circuit by SAP(Semi-Additive-Process).
Microvias which is advantage for high speed modules can be formed on PTH or microvias (stacking) reducing line length.

Features

  • High density and high layer build up structure.
  • Narrow bump pitch
  • High interconnecting and insulating reliability

Specifications

Specifications
Item Standard Manufacturing Specifications
Number of layers 4-22 layers
Line/Space 14/14µm or more
Microvia diameter 55µm or more
Thickness of insulating layer 30µm ore more
C4 bump pitch. 150µm or more

Applications

  • Microprocessing unit
  • Peripheral chipset
  • Graphics processor
  • Network memory module

Please contact at the following address for any inquiries and any requests for quotations regarding PKG substrate.
For Inquiries

Business Administration Group 3,Business Administration Division,
Business Solution Unit 1
Advanced Package Operation, Electronics Operation Group
905 Kido-cho, Ogaki, Gifu 503-0973, Japan

Return to Top of Page