| Institution / organization |
Title |
| Japan Institute of Electronics Packaging |
Fundamental Study on Optical Interconnection for Next Generation-Analysis of VCSEL's
Emission Modes and Optical Coupling- |
| Surface Mount Technology Association (SMTA) |
Control of The Warpage for Package-on-Package (POP) Design |
| Japan Institute of Electronics Packaging |
Next generation optical interconnect substrate technology
light-emitting-mode analysis and optical coupling simulation |
| The Insutitute of Electrical and Electronics Engineers,Inc.(IEEE) |
Structural Design for Cu/Low -K Large Die Flip Chip Package |
