| Institution / organization |
Title |
| Japan Institute of Electronics Packaging (JIEP) |
Application of AIN Substraye to Electric Devices and Metal Difusion on Power Element Packing |
| The Insutitute of Electrical and Electronics Engineers,Inc. (IEEE),Assocation of Super-Advanced Electronics Technologies(ASET) |
A Power Supply Noise Evaluation System with Fully-Customized Test Chip for 3D-Integration |
| Japan Institute of Electronics Packaging , EPADs |
Expectation and Objectives of Device Embedded Substrate |
| Advanced Metallization Conference 2010:20th Asian Session |
Defect Analysis of Electro-chemical Migration in Micro Patterning |
| Advanced Metallization Conference 2010:20th Asian Session |
Mechanism Verification on the Electrochemical Migration of Fine Cu Wiring |
| Aseanian Membrane Society(AMS6)/International Membrane Science and technology Conference(IMSTEC10) |
Structure-property Relationship of Polyimide Based Hybrids for Gas Separation Membranes |
| ISMP2010 |
Current Status and Future of LSI Packaging and SiP Substrate |
| Institution / organization |
Title |
| Society of Automotive Engineerings,Inc. (SAE) |
Characteristics of NH3 Adsorption/Consumption for SCR on Zeolite-base Honeycomb Substrate |
| Society of Automotive Engineerings,Inc. (SAE) |
Characteristics of NH3 Adsorption/Consumption for SCR on Zeolite-base Honeycomb Substrate |
| Society of Automotive Engineerings,Inc. (SAE) |
PM After-Treatment of Direct Injection Gasoline by Using |
| International Conference on Modern Materials and Tecnologies 2010 |
A New Technology with Porous Materials:Progress in the Development of the Diesel Vehcle Business |
| The Ceramic Society of Japan The 3rd International Congress on Ceramics in Osaka |
Recovery of SiC Powder from Sintered DPF Using Hydrothermal Treatment Combined with Ball-milling Technique. |
The Ceramic Society of Japan
Annual Meeting 2011 |
Recovery of Pt Catalyst from Spent Diesel Particulate Filter(Applied to academy) |
| Japanese Jouranal Applied Physics(JJAP) |
Mechanism Verification on the Electrochemical Migration of Fine Cu Wiring |
