Publication | FY2010

Papers for Electronic Technologies

Institution / organization Title
Japan Institute of Electronics Packaging (JIEP) Application of AIN Substraye to Electric Devices and Metal Difusion on Power Element Packing
The Insutitute of Electrical and Electronics Engineers,Inc. (IEEE),Assocation of Super-Advanced Electronics Technologies(ASET) A Power Supply Noise Evaluation System with Fully-Customized Test Chip for 3D-Integration
Japan Institute of Electronics Packaging , EPADs Expectation and Objectives of Device Embedded Substrate
Advanced Metallization Conference 2010:20th Asian Session Defect Analysis of Electro-chemical Migration in Micro Patterning
Advanced Metallization Conference 2010:20th Asian Session Mechanism Verification on the Electrochemical Migration of Fine Cu Wiring
Aseanian Membrane Society(AMS6)/International Membrane Science and technology Conference(IMSTEC10) Structure-property Relationship of Polyimide Based Hybrids for Gas Separation Membranes
ISMP2010 Current Status and Future of LSI Packaging and SiP Substrate

Papers for Ceramic Technologies

Institution / organization Title
Society of Automotive Engineerings,Inc. (SAE) Characteristics of NH3 Adsorption/Consumption for SCR on Zeolite-base Honeycomb Substrate
Society of Automotive Engineerings,Inc. (SAE) Characteristics of NH3 Adsorption/Consumption for SCR on Zeolite-base Honeycomb Substrate
Society of Automotive Engineerings,Inc. (SAE) PM After-Treatment of Direct Injection Gasoline by Using
International Conference on Modern Materials and Tecnologies 2010 A New Technology with Porous Materials:Progress in the Development of the Diesel Vehcle Business
The Ceramic Society of Japan The 3rd International Congress on Ceramics in Osaka Recovery of SiC Powder from Sintered DPF Using Hydrothermal Treatment Combined with Ball-milling Technique.
The Ceramic Society of Japan
Annual Meeting 2011
Recovery of Pt Catalyst from Spent Diesel Particulate Filter(Applied to academy)
Japanese Jouranal Applied Physics(JJAP) Mechanism Verification on the Electrochemical Migration of Fine Cu Wiring