IC packaging substrate technology realizing microscopic patterning and high-density for state-of-the-art, high-speed devices. Our IC packaging substrates are widely used for computer-related products including MPUs, chip sets, graphical processors, and server products. We satisfy our customers' needs with products boasting high quality and superior reliability.
Small and thin packaging substrates are used for smartphone processors and their peripheral devices. We achieve microscopic patterns and high density by applying micro-patterning technologies acquired in our IC packaging business to deliver small and thin package substrates. These are essential for markets providing high-speed communication and sensor modules.
Our proprietary core technologies enable high functionality and high density of printed circuit boards. We provide products to support the contemporary needs of our customers such as build-up substrates required by global smartphones manufacturers, and complex modular substrates.