Flip Chip PKG
What are IC Package Substrates?
An IC package substrate is a significant part working in conjunction with IC chips, whose added values are increasing to match more advanced semiconductor performance.
Feature
Conductor Patterning Technology to Enable Ultra-Fine Wiring
With a focus on SAP (Semi Additive Process), we provide the world-class micro patterning. We are also promoting the development of conductor patterning technologies of semiconductor revel toward future.
Micro-Via with High Connection Reliability
Micro-Via that connects between layers is one of the most important elements of IC package substrates. With our unique alignment technique and state-of-the-art lasing and metal planting technologies, we realize Micro-Via boasting not only connection reliability but also electrical characteristics.
Applications
MPU for PC and Data Center, Semiconductors: GPU for AI and Vehicles